BERGQUIST® LIQUI BOND TLB EA1800
Conocido como Liqui-Bond® EA 1805
Características y Ventajas
This silicone-free, 2-part epoxy liquid is designed for applications where mechanical and chemical stability are needed.
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally conductive epoxy liquid adhesive with excellent chemical and mechanical stability. The product cures at room temperature and creates high bond strength, which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion (CTE).
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Información técnica
| Conductividad térmica | 1.8 W/mK |
| Resistencia a la flama | V-0 |
| Temperatura de funcionamiento | -40.0 - 125.0 °C |
| Endurecedor | |
| Color, Endurecedor | Amarillo claro |
| Resina | |
| Color, Resina | Gris |
BERGQUIST® LIQUI BOND TLB EA1800
This silicone-free, 2-part epoxy liquid is designed for applications where mechanical and chemical stability are needed.