BERGQUIST® GAP FILLER TGF 1000SR

BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap-filling material that features superior slump resistance. The mixed system will cure at room temperature, or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.