BERGQUIST® GAP PAD® TGP HC3000
Conocido como Gap Pad® HC 3.0
Características y Ventajas
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
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Información técnica
| Color | Azul |
| Conductividad térmica | 3.0 W/mK |
| Espesor | 0.508 - 3.175 mm |
| Módulo de Young, ASTM D575 | 110.0 KPa (16.0 psi ) |
| Resistencia a la flama | V-0 |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Tipo de vehículo | Fibra de Vidrio |
BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.