BERGQUIST® GAP PAD® TGP 5000
Features and Benefits
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fibreglass to protect against punctures, and with improved shear and tear resistance and natural tack on both sides, this product is easy to handle and ideal for high-performance applications at low mounting pressures.
- High thermal conductivity: 5 W/m-K
- Highly conformable softness
- Natural inherent tack reduces interfacial thermal resistance
- For information on our thermal management materials’ UL certifications, please refer to UL file E59150
Documents and Downloads
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Technical Information
| Colour | Light green |
| Density | 3.6 g/cm³ |
| Dielectric breakdown voltage | 5000.0 Vac |
| Dielectric constant, @ 1kHz | 7.5 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.0 J/g-K |
| Operating temperature | -60.0 - 200.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 35.0 |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 5.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 5000
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.