BERGQUIST® GAP PAD® TGP 3004SF
Bekend als Gap Pad® 3004SF
Kenmerken en voordelen
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone-sensitive applications.
Meer info
Documenten en downloads
Op zoek naar een TDS of MSDS in een andere taal?
Technische informatie
| Dichtheid, Maximum Final | 3.2 g/cm³ |
| Gebruikstemperatuur | -40.0 - 125.0 °C |
| Kleur | Lichtgrijs |
| Shore hardheid, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 | 70.0 |
| Standaard dikte | 0.254 - 3.715 mm |
| Thermische geleidbaarheid | 3.0 W/mK |
| Type drager | 0,25 mil PET-folie |
| Vlammenclassificatie | V-0 |
BERGQUIST® GAP PAD® TGP 3004SF
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.